The Ministry of Industry and Information Technology has released a list of key new materials, including carbon fiber, high-purity graphite, carbon/carbon composites, and other new materials for Beijing Airlines' special carbon business!

Recently, the website of the Ministry of Industry and Information Technology released the first batch of application demonstration guidelines for key new materials (2024 version) (draft for comments). According to the draft for soliciting opinions, advanced chemical materials include special rubber and other polymer materials, engineering plastics, film materials, and other advanced chemical materials, totaling 52 types. In addition, the catalog also covers a total of 296 key new materials, including 33 high-performance fibers and composite materials, 45 advanced semiconductor materials and new display materials, 10 new energy materials, 16 biomedical and biodegradable materials, and 16 cutting-edge new materials.

The following is a list of carbon related materials and corresponding performance requirements, including advanced non-ferrous metals, advanced inorganic non-metallic materials, high-performance fibers and composite materials, advanced semiconductor materials and new display materials, cutting-edge new materials, etc., in the guidance catalog:

Advanced Basic Materials

Aluminum based silicon carbide composite material

Indoor thermal conductivity ≥ 200 W/(m · K), flexural strength ≥ 500MPa, thermal expansion coefficient (RT~200 ℃) ≤ 9ppm/℃.

High performance aerospace graphite sealing materials and products

Compressive strength ≥ 140MPa, flexural strength ≥ 60MPa, Shore hardness 75-95Hs, graphitization degree ≥ 85%, friction coefficient ≤ 0.15, open porosity ≤ 2%, thermal weight loss ≤ 5% (650 ℃, 50 h), particle size ≤ 10 μ m, thermal conductivity ≥ 60 W/(m · K) (400 ℃), Poisson's ratio 0.23-0.25, thermal expansion coefficient ≤ 5 × 10-6/℃, bulk density ≥ 1.95g/cm3.

High thermal conductivity artificial graphite film

The horizontal thermal conductivity is ≥ 1500W/(m · K), and the film thickness is between 12 μ m and 500 μ m.

Ultra large circular fine structured graphite for polycrystalline silicon

Finished product size: Φ 1360/890mm × 1100mm; Volume density ≥ 1.75 g/cm3; Flexural strength ≥ 35MPa; CTE ≤ 5.3 × 10-6/K.

Ultra fine diamond wire saw

(1) Carbon steel wire saw: The diameter of the carbon steel wire saw is less than 48 microns, the breakage rate is ≤ 8%, the outer diameter error is ≤ 5 μ m, the tensile strength is ≥ 5200MPa, and the free circle diameter is ≥ 50mm;

(2) Tungsten wire saw: The diameter of the tungsten wire saw is less than 45 microns, the breakage rate is ≤ 8%, the tensile strength is ≥ 6000Mpa, the outer diameter error is ≤ 5 μ m, and the free circle diameter is ≥ 50 mm.

Key strategic materials

High performance carbon fiber

(1) High strength type: tensile strength ≥ 4500 MPa, CV ≤ 5%, tensile modulus 230-250 GPa, CV ≤ 2%;

(2) High strength medium model: tensile strength ≥ 5500 MPa, CV ≤ 5%, tensile modulus 285-305 GPa, CV ≤ 2%;

(3) High model: tensile strength ≥ 4200MPa, CV ≤ 5%, tensile modulus 400GPa, CV ≤ 2%.

Carbon fiber woven fabric for ships

Fiber: T700-12K, ethylene based sizing agent; Woven fabric: single, double, and triaxial carbon fiber fabric, with a surface density range of 200~900g/m2 and a tolerance of ± 5%; Enhance the mechanical properties of ethylene based resin composite materials: uniaxial interlayer shear strength ≥ 50Mpa, biaxial interlayer shear strength ≥ 35Mpa.

Carbon fiber composite materials for aviation interiors

0 ° tensile strength>1700MPa, 0 ° tensile modulus>100GPa, bending strength>1200MPa, density ≤ 1.6g/cm3, flame retardant: according to CCAR25.853 standard, heat release ≤ 65kW/m2, smoke density ≤ 2004 Dm.

Carbon fiber/epoxy resin composite material

Interlayer shear strength>70MPa, bending strength>1200MPa, tensile strength>1800MPa.

Carbon fiber composite material for hydrogen storage cylinders

(1) Fuel cell hydrogen cylinders for vehicles and ships: working pressure ≥ 35MPa, service life 10-15 years, mass hydrogen storage density 4.0%;

(2) Fuel cell hydrogen cylinder for unmanned aerial vehicles: working pressure of 35MPa, service life of 5 years, mass hydrogen storage density of 7.0%.

Large bundle carbon fiber and its thermoplastic composite materials

Domestically produced carbon fiber bundles with a diameter of ≥ 48K. Linear density ≥ 3300g/km, tensile strength ≥ 4000MPa, CV ≤ 8%; Tensile modulus ≥ 235GPa, CV ≤ 4%.

High weather resistant glass fiber/carbon fiber composite material

The maximum tensile strength is ≥ 600 kN/m, elongation rate is ≤ 3%, and temperature resistance is -100~280 ℃.

Carbon/carbon composite materials for aviation braking

Density ≥ 1.85 g/cm3; Compressive strength ≥ 150MPa; Bending strength ≥ 120 MPa; Interlayer shear strength ≥ 12MPa; Graphitization degree ≥ 35%; Oxidation weight loss rate ≤ 5%; High energy braking (energy flow density ≥ 3000kW/m2, area load ≥ 60 MJ/m2); Friction coefficient ≥ 0.25.

High performance carbon fiber reinforced ceramic based friction materials

Density ≤ 2.2 g/cm3; Operating temperature -50~1650 ℃; Compressive strength ≥ 160MP; Bending strength ≥ 120MP; Friction coefficient 0.25-0.45; Peak friction torque ratio ≤ 2; Friction coefficient thermal degradation ≤ 15%; Wet state degradation of friction torque ≤ 5%.

Silicon carbide single crystal substrate and homogeneous epitaxial wafer

(1) Silicon carbide single crystal substrate: 6 inches and above, micro tube density ≤ 0.2/cm2, TTV<10 µ m, -15 µ m<bow<15 µ m, warp<35 µ m, surface roughness Ra ≤ 0.15nm; The resistivity of N-type silicon carbide substrate is 0.015-0.025 Ω· cm, with BPD<1000/cm2; The resistivity of the semi insulating silicon carbide substrate is ≥ 1010 Ω· cm.

(2) Silicon carbide homogeneous epitaxial wafer: larger than 6 inches, uneven concentration within the epitaxial wafer: ≤ 10%; Uneven thickness within epitaxial wafers: ≤ 5%; Epitaxial surface defect density: ≤ 1cm-2; Epitaxial surface roughness: ≤ 0.3nm.

Ultra high purity graphite for semiconductors

Ash content ≤ 5 ppm; B. Al and Fe content ≤ 0.01ppm; Electrical resistivity (μ Ω· m): 11-15.

Frontier New Materials

Graphene heat dissipation material

(1) Graphene heat dissipation material: XY axis thermal conductivity ≥ 1950 W/(m · K), Z-axis thermal conductivity ≥ 22 W/(m · K), radiation coefficient ≥ 92%, film thickness 25-500 μ m;

(2) Graphene heat dissipation coating: adhesion level 0, thermal emissivity ≥ 95%, planar thermal conductivity ≥ 100W/(m · K), neutral salt spray resistance ≥ 5000h, temperature resistance ≥ 200 ℃, hardness ≥ 2H.

Graphene thermal conductive composite material

(1) Graphene high thermal conductivity composite material for lighting/communication: thermal conductivity>20 W/(m · K), tensile strength>29 MPa, bending strength>45 MPa, cantilever beam without notch impact strength>3.0 Kj/m2, flame retardant up to V0 level, density<1.6 g/cm3, thermal radiation rate ≥ 0.8, weather resistance, corrosion resistance, etc.

(2) Graphene high thermal conductivity composite pipe: density<200 ℃, burst pressure>5 MPa, long-term use pressure>1 MPa, thermal radiation rate>0.8, acid and alkali resistant corrosive media.

Graphene explosion-proof electric heat tracing film material

Rated power of 10-120W/m; Temperature resistance ≥ 200 ℃; The maximum maintenance temperature of the medium is 150 ℃; Dimensions: Thickness 0.6-5.0mm; Width of 80-500 mm; The maximum usage length of a single power supply is 6-300m; Insulation resistance ≤ 50 MQ.

Carbon nanotubes

(1) Single walled carbon nanotube conductive paste: solid content of the paste ≥ 0.8%, volume resistivity of the paste: ≤ 12 m Ω· cm; Slurry viscosity ≤ 6000 mPa · s;

(2) High performance dispersant for carbon nanotubes: moisture ≤ 0.2%, Al≤10mg/kg、Ca≤20mg/kg、Co≤10mg/kg、Cu≤20mg/kg、Cr≤10mg/kg、Mg≤10mg/kg、Mn≤10mg/kg、Na≤40mg/kg、Ni≤10mg/kg、Zn≤20mg/kg、Fe≤50mg/kg； APEO free, VOC ≤ 2%, with an added amount of less than 30%.